Dicing Saw - MTI SYJ-800
Description
Precision CNC Dicing Saw - SYJ-800 is PC-controlled and capable of both manual operations and fully automated wafer dicing.
Motorized axis (X, Y, Z rotation) with 10 um precision. Holds up to 8" diameter wafers and smaller.
![Image of a dicing saw on a lab bench next to a laptop](/research-innovation/sites/g/files/bhrskd326/files/2022-03/Dicing%20saw.jpg)