Description

The SAMCO RIE-10NR is a fully automatic, dry etching system which meets the most demanding process requirements for fluorine chemistries. Etching is performed with minimum sidewall deterioration and high selectivity between materials. It can process wafers of up to 8” in diameter. The computerized touch panel allows for parameter control and recipe entry as well as storage.

Applications include anisotropic etching of all types of silicon based thin films, compound semiconductors, and refractory metals (including Si, SiO2, Poly-Si, Si3N4, GaAs and Mo) as well as micromachine manufacture and failure analysis.

Download the SAMCO RIE-10NR Etching System Brochure (PDF version, 64 KB) 

Image of the SAMCO RIE-10NR Etching System